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300mm Wafer Sorter

Product Detail Information

 Features
Robot in Planing System Transferring Using Multi-jonts

 

Small Foot Print

 

Customize version of software available for maximum work efficiency

 

4 axis Clean Robot available

 

Uer's unique requirments are fully met through individually developed Software

 

Free support, regardless of warranty specifications

(whenever new versions of software become available)
Specification
- SYSTEM CONFIGURATION -

 

1. MTBF / MTBI: ≥ 4000Hrs / ≥ 500Hrs

 

2. MWBI: ≥ 10,000Wafers

 

3. MTTR: ≤ 2 Hrs

 

4. Mpping: FOUP Opener Mapping or Robot Mapping

 

5. ID Reading Type: BAR Code Reading or RF ID Reading

 

6. Foot Print: 940(W) × 1590(D)

 

7. Throught- Put (Without Align & OCR): ≥ 500 wfs / Hrs

 

                        (Without Align): ≥ 300 wfs / Hrs

 

                        (Without Align & OCR): ≥ 200 wfs / Hrs

 

8. Transfer Relisbility: ≥ 50,000 Wfs no error

 

9. Mapping Reliability; ≥ 50,000 Wfs no error

 

10. Pre- Alingn Reliability: ≥ 50,000 Wfs no error

 

11. Multple End - Effect: Signal Arm

 

12. WF ID Reading Type: OCR Reading Type

 

13. loadports(MAX): 3EA

 

14. Pick - UP Tip Type: Vacuum Type

 

15. Hsot Communicaition Metode:  SECS ll GEM or HSMS

 

16. OS / Applicaition Program Tool: Windows NT & Windows 2000 / High Language

 

17. lonization: OK

 

18. AMHS(AGV / OHT / REV): OK

 

19. PWP: ≤ 0.73 PWP

 

20. FFU Air Flow Spec: 0.4 m/s D.O.P 99.9999% / 0.12㎛

 

21.  FOUP Type(13/25): The same time of possible